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Wangling TF600 2-Layer 0.7mm ENIG PCB for 5G Antenna & Radar Applications
1. Introduction to TF600 PCB
TF600 is a thermosetting high-frequency laminate composed of modified PTFE resin and micron-sized ceramic fillers, featuring excellent microwave performance and temperature resistance, balancing ultra-low dielectric loss, stable DK consistency and FR4-compatible processing (drilling, plating, lamination). It supports 260℃ lead-free assembly. With excellent thermal stability and moisture resistance, it's ideal for high-reliability RF/microwave designs where low insertion loss and signal integrity are critical. It contains no glass fiber cloth.
This 2-layer rigid PCB is constructed entirely with TF600 as the core material, providing exceptional signal integrity, low insertion loss, and thermal stability for demanding RF, microwave, and 5G/6G applications.
2.Key Features of TF600
Dielectric Constant (DK): 6.0 ± 0.15 at 10GHz (core for high-frequency impedance matching) Dissipation Factor (Df): 0.0025 at 10GHz (ultra-low loss for signal integrity) Tg: >280℃ (DSC, high thermal stability) Thermal resistance: T260 >60 minutes, T288 >20 minutes (lead-free assembly compliant) Peel strength (Min.): 0.80 N/mm (≈9.2 lbs/inch) for 1OZ ED Copper CTE: X=14-16 ppm/℃, Y=12-14 ppm/℃, Z=40-45 ppm/℃ (dimensional stability) Moisture Absorption (Max.): 0.06% (low water uptake for reliability) UL 94-V0 flammability rating High CAF resistance and chemical corrosion resistance Thermal Conductivity: 0.60 W/m·K (efficient heat dissipation)
3.Benefits of TF600 PCB
Ultra-low dielectric loss for excellent signal integrity Stable DK consistency across frequency and temperature FR4-compatible processing (drilling, plating, lamination) Supports 260℃ lead-free assembly Excellent thermal stability and moisture resistance No glass fiber cloth – homogeneous dielectric properties High CAF resistance and chemical corrosion resistance Efficient heat dissipation for high-power applications
4.TF600 PCB Construction Details
| Item | Specification |
|---|
| Base material | TF600 |
| Layer count | 2 layers |
| Board dimensions | 78mm x 65mm = 1PCS, +/- 0.15mm |
| Minimum Trace/Space | 5/6 mils |
| Minimum Hole Size | 0.35mm |
| Blind vias | No |
| Finished board thickness | 0.7mm |
| Finished Cu weight | 1 oz (1.4 mils) outer layers |
| Via plating thickness | 20 μm |
| Surface finish | ENIG |
| Top Silkscreen | Black |
| Bottom Silkscreen | No |
| Top Solder Mask | No |
| Bottom Solder Mask | No |
| Copper filling vias | On designated IC Pad |
| 100% Electrical test | Used prior to shipment |
5.PCB Stackup (2-Layer Rigid Structure)
Copper_layer_1 – 35 μm
TF600 – 0.635 mm (25 mil)
Copper_layer_2 – 35 μm
6.PCB Statistics
Components: 43
Total Pads: 61
Thru Hole Pads: 32
Top SMT Pads: 29
Bottom SMT Pads: 0
Vias: 34
Nets: 2
7.Primary Application Areas
Microwave/RF Transceivers 5G/6G Massive MIMO Antennas Radar Systems (Automotive ADAS, Aerospace) Satellite Communication Payloads High-Power RF Amplifiers Test & Measurement Equipment (Vector Network Analyzers)
8.Quality Assurance
Artwork supplied: Gerber RS-274-X
Accepted standard: IPC-Class-2
Availability: Worldwide
9.TF600 Ceramic-Filled PTFE High-Frequency Laminate – Product Introduction
This product is composed of PTFE resin material with excellent microwave performance and temperature resistance, compounded with ceramics. The material contains no glass fiber cloth. The dielectric constant is precisely adjusted by controlling the ratio between ceramic and PTFE resin. The production process is special, resulting in excellent dielectric properties and high reliability.
TF refers to unclad smooth surface material, TF-1 refers to single-sided copper clad material, and TF-2 refers to double-sided copper clad material.
10.Features and Benefits
Key Features
Dielectric constant range from 3 to 16 with stable performance. Common dielectric constants include 3.0, 6.0, 9.2, 9.6, 10.2, 16. Low dielectric loss. Suitable for microwave and millimeter wave printed circuit board fabrication. Long-term operating temperature is higher than TP materials, can be used long-term in the range of -80℃ to +200℃. Thickness available from 0.635mm to 2.5mm. Radiation resistant and low outgassing. Easy to process using standard thermoplastic material processing methods.
Benefits
Ultra-low dielectric loss for excellent signal integrity Stable DK consistency across frequency and temperature FR4-compatible processing (drilling, plating, lamination) Supports 260℃ lead-free assembly Excellent thermal stability and moisture resistance No glass fiber cloth – homogeneous dielectric properties High CAF resistance and chemical corrosion resistance
11.TF600 Data Sheet
| Property | Test Condition | Units | TF600 Typical Value |
|---|
| Dielectric Constant | 10 GHz | – | 6.0 ± 0.12 |
| Dielectric Constant Tolerance | – | % | ±2% |
| Dissipation Factor | 10 GHz | – | 0.0010 |
| Temperature Coefficient of Dk | -55°C to 150°C | ppm/°C | -210 |
| Peel Strength (1 oz, Normal State) | – | N/mm | >0.6 |
| Peel Strength (1 oz, After Damp Heat) | – | N/mm | >0.4 |
| Volume Resistivity | Normal State, 500V | Mohm·cm | >1 × 10⁹ |
| Surface Resistivity | Normal State, 500V | Mohm | >1 × 10⁷ |
| CTE (X, Y, Z axis, -55°C to 150°C) | – | ppm/°C | 60, 60, 80 |
| Moisture Absorption | 20±2°C, 24 hours | % | ≤0.05 |
| Long-Term Operating Temperature | – | °C | -80 to +200 |
| Density | – | g/cm³ | 2.78 |
| Thermal Conductivity | – | W/(m·K) | 0.45 |
| Material Composition | – | – | PTFE + Ceramic + ED Copper |
| Flammability Rating | UL-94 | Class | V-0 |
12.Some Typical Applications
Microwave/RF Transceivers 5G/6G Massive MIMO Antennas Radar Systems (Automotive ADAS, Aerospace) Satellite Communication Payloads High-Power RF Amplifiers Test & Measurement Equipment (Vector Network Analyzers)
13.Standard Thicknesses, Panel Sizes & Claddings
Available Copper Foil Options
| Parameter | Specification |
|---|
| Copper foil type | ED copper |
| Copper foil thickness | 0.018 mm, 0.035 mm |
Standard Panel Sizes
150 mm × 150 mm 250 mm × 250 mm
Available Thicknesses and Tolerances
Note: The following thicknesses can be either total thickness including copper or dielectric thickness. Please specify when ordering whether you require "total thickness including copper" or "dielectric thickness".
Electrodeposited Copper Foil:
| Thickness (mm) | Tolerance (mm) |
|---|
| 0.635 | ±0.04 |
| 0.8 | ±0.05 |
| 1.0 | ±0.05 |
| 1.2 | ±0.05 |
| 1.5 | ±0.06 |
| 2.0 | ±0.08 |
| 2.5 | ±0.01 |
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